A variational model for fracture and debonding of thin films under in-plane loadings
We study fracture and debonding of a thin stiff film bonded to a rigid substrate through a thin compliant layer, introducing a two-dimensional variational fracture model in brittle elasticity. Fractures are naturally distinguished between transverse cracks in the film (curves in 2D) and debonded surfaces (2D planar regions). In order to study the mechanical response of such systems under increasing loads, we formulate a dimension-reduced, rate-independent, irreversible evolution law accounting for both transverse fracture and debonding. We propose a numerical implementation based on a regularized formulation of the fracture problem via a gradient damage functional, and provide an illustration of its capabilities exploring complex crack patterns, showing a qualitative comparison with geometrically involved real life examples. Moreover, we justify the underlying dimension-reduced model in the setting of scalar-valued displacement fields by a rigorous asymptotic analysis using Γ-convergence, starting from the three-dimensional variational fracture (free-discontinuity) problem under precise scaling hypotheses on material and geometric parameters. © 2014 Elsevier Ltd.
Publication Source (Journal or Book title)
Journal of the Mechanics and Physics of Solids
León Baldelli, A., Babadjian, J., Bourdin, B., Henao, D., & Maurini, C. (2014). A variational model for fracture and debonding of thin films under in-plane loadings. Journal of the Mechanics and Physics of Solids, 70 (1), 320-348. https://doi.org/10.1016/j.jmps.2014.05.020