Identifier

etd-04142005-162001

Degree

Master of Science in Mechanical Engineering (MSME)

Department

Mechanical Engineering

Document Type

Thesis

Abstract

The new generation of electronic devices are more powerful, and they produce more heat. Hence, there is a need for micro cooling systems for removing the heat from these micro chips. This research focused on one micro cooling system-the micro jet cooling array. Some test simulations were made on a single jet cooling system. In addition, the inlet Reynolds number was varied in order to obtain the variation of the heat transfer coefficient. These simulations gave a basic idea of how the impingement cooling method works on the micro jet cooling array. Numerical simulations were made on the actual micro jet cooling array. Simulations consisted of variation of parameters (geometry, Reynolds number, heat flux). When the micro jet cooling array from MEZZO systems was simulated with no wall separating the outlet region from the impingement area, performance was enhanced. In fact, this system presents the lowest pressure drop through the device and has the same heat transfer rate on the cooling surface. The relationship between the heat transfer rate and the inlet Reynolds number was established for the micro jet cooling array system (for instance an inlet Reynolds number of 1033, the heat transfer coefficient average on the cooling surface is 9.9W/(cm2.K)).

Date

2005

Document Availability at the Time of Submission

Release the entire work immediately for access worldwide.

Committee Chair

Dimitris E. Nikitopoulos

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