Identifier

etd-08292011-141729

Degree

Master of Science in Electrical Engineering (MSEE)

Department

Electrical and Computer Engineering

Document Type

Thesis

Abstract

Ultrasound has broad range of applications from underwater examination, nondestructive testing of materials and medical diagnosis and treatment. The ultrasonic transducer plays an vital role in determining the resolution, sensitivity, as well as other diagnostic capabilities of an ultrasonic imaging system. Current piezoelectric transducer which dominates the medical field has limited applications compared to the capacitive ultrasonic transducer. The capacitive transducer is easy to fabricate compared to the piezoelectric transducer. In this work, the fabrication of a foldable substrate for a capacitive ultrasonic transducer has been discussed. The foldable substrate was fabricated using an ultrathin silicon wafer which is 50 µm thick by using the principle of polymer shrinkage. It is believed that the foldable substrate can be used in intravascular ultrasound (IVUS) and endoscopic ultrasound (EUS) applications for next generation biomedical imaging.

Date

2011

Document Availability at the Time of Submission

Release the entire work immediately for access worldwide.

Committee Chair

Hah, Dooyoung

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